TSMC joins multibeam mask-writing club
LONDON – Leading foundry chip maker Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) has joined a multibeam mask writer development consortium hosted by IMS Nanofabrication AG (Vienna, Austria). TSMC joins founder members Dai Nippon Printing Co. Ltd. (DNP), Intel, and Photronics Inc.
The purpose of the collaborative program is to develop a multibeam electron-beam mask writer for use in advanced mask lithography applications below 10-nm while achieving high throughput.
The program is nearing the completion of a proof-of-concept phase and the upcoming phase of the collaboration will focus on the design and construction of an alpha and beta version of the multi-beam mask writer, IMS said.
"We are very encouraged by this partnership's goal of producing a mask writer with both accuracy and high productivity around 2015 for nodes beyond 10 nanometers. This project shows great potential for producing that breakthrough," said C.S. Yoo, head of e-beam operations at TSMC, in a statement issued by IMS.
No indication was given with regard to any financial commitment by TSMC or by the founding members.
Related links and articles:
www.ims.co.at
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TAG:TSMC Intel Photronics IMC nanofabrication mask e beam electron multibeam
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