2012-06-30

DoD's dubious achievement awards

DoD's dubious achievement awards


WASHINGTON – It’s awards season over at the Pentagon. The latest list of “value engineering achievement award” winners announced this week (June 27) runs for seven pages, leading one to conclude that the Defense Department hands out awards much like the Little League presents every ballplayer a trophy regardless of where his team finished in the standings.

What is value engineering and how do you win this award? It turns out that VE is “an important contributor to the ‘Better Buying Power’ program of continuous improvement in defense acquisition,” explains Frank Kendall, the Pentagon’s acquisition czar. Without explaining how it calculated the number, Kendall claims the program has delivered no less than $51 billion in savings and “cost avoidance” since 1980.

That’s a lot of dough, even by Pentagon standards.

We don’t doubt that the value engineering award winners are deserving of recognition. Our problem with the program and others like it is that it simply doesn’t square with the facts about U.S. weapon procurement, which is fraught with waste, lack of oversight and a cost-plus mentality the encourages contractors to jack up development costs.

A classic example of the problem was uncovered recently by veteran Pentagon reporter Walter Pincus of the Washington Post. Pincus is old school. He actually read the 514-page Senate Armed Services Committee report defense authorization bill.

Here’s what Pincus found: For one weapon program alone, the F-35 Lighting II Joint Strike Fighter, the report quoted the program manager as acknowledging a budget “miscalculation” that will cost tax payers an additional $7.9 billion dollars and delay overall aircraft development by almost three years.

That’s $7.9 billion that won’t be available to U.S. troops fighting in Afghanistan.

The F-35 “miscalculation,” it turns out, was about “concurrency,” the Pentagon’s term for the overlapping development of subsystems like avionics, aircraft testing and production. Advanced fighter aircraft development appears to have become so complex that attempts to move down multiple development and production tracks no longer works.

Meanwhile, the soaring cost of the F-35 program continues to grow. Reuters reported in March that the total cost to develop, buy and operate the aircraft is now estimated at an astounding $1.45 trillion.

Does the U.S. military need more than 2,400 fifth-generation stealth fighters? I would argue that our current fleet of fighter aircraft led by the F-22 is sufficient. But the F-35 is too far down the road, with contractors (giant U.S. weapon manufacturer Lockheed Martin Corp is the prime contractor) and subcontractors in nearly every state, to be shelved.

There were no Air Force “value engineering” awards announced this year. We’re guessing there won’t be anytime soon for the F-35 program.
TAG:Department of Defense Joint Strike Fighter Pentagon Procurement F 35 DoD Procurement Avionics

DoD's dubious achievement awards

DoD's dubious achievement awards


WASHINGTON – It’s awards season over at the Pentagon. The latest list of “value engineering achievement award” winners announced this week (June 27) runs for seven pages, leading one to conclude that the Defense Department hands out awards much like the Little League presents every ballplayer a trophy regardless of where his team finished in the standings.

What is value engineering and how do you win this award? It turns out that VE is “an important contributor to the ‘Better Buying Power’ program of continuous improvement in defense acquisition,” explains Frank Kendall, the Pentagon’s acquisition czar. Without explaining how it calculated the number, Kendall claims the program has delivered no less than $51 billion in savings and “cost avoidance” since 1980.

That’s a lot of dough, even by Pentagon standards.

We don’t doubt that the value engineering award winners are deserving of recognition. Our problem with the program and others like it is that it simply doesn’t square with the facts about U.S. weapon procurement, which is fraught with waste, lack of oversight and a cost-plus mentality the encourages contractors to jack up development costs.

A classic example of the problem was uncovered recently by veteran Pentagon reporter Walter Pincus of the Washington Post. Pincus is old school. He actually read the 514-page Senate Armed Services Committee report defense authorization bill.

Here’s what Pincus found: For one weapon program alone, the F-35 Lighting II Joint Strike Fighter, the report quoted the program manager as acknowledging a budget “miscalculation” that will cost tax payers an additional $7.9 billion dollars and delay overall aircraft development by almost three years.

That’s $7.9 billion that won’t be available to U.S. troops fighting in Afghanistan.

The F-35 “miscalculation,” it turns out, was about “concurrency,” the Pentagon’s term for the overlapping development of subsystems like avionics, aircraft testing and production. Advanced fighter aircraft development appears to have become so complex that attempts to move down multiple development and production tracks no longer works.

Meanwhile, the soaring cost of the F-35 program continues to grow. Reuters reported in March that the total cost to develop, buy and operate the aircraft is now estimated at an astounding $1.45 trillion.

Does the U.S. military need more than 2,400 fifth-generation stealth fighters? I would argue that our current fleet of fighter aircraft led by the F-22 is sufficient. But the F-35 is too far down the road, with contractors (giant U.S. weapon manufacturer Lockheed Martin Corp is the prime contractor) and subcontractors in nearly every state, to be shelved.

There were no Air Force “value engineering” awards announced this year. We’re guessing there won’t be anytime soon for the F-35 program.
TAG:Department of Defense Joint Strike Fighter Pentagon Procurement F 35 DoD Procurement Avionics

2012-06-29

Novaled expands agreement with Samsung Mobile Display

Novaled expands agreement with Samsung Mobile Display

MANHASSET, NY -- Novaled has entered into a multi-year licensing and purchase agreement with Samsung Mobile Display to provide dopant materials used in the transport layers of its AMOLED display modules from Novaled.

In addition, Novaled will provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.

The agreement is the latest between the two companies. Samsung has cooperated with Novaled in the field of technologies and materials for advanced OLED products since 2005.

“We are focused on developing innovative and state-of-the-art OLED technology, and so we have maintained a close cooperation with Novaled,” said S.I. Cho, President and CEO of Samsung Mobile Display, in a statement.

Novaled, founded in 2001 as a spin-off of the Technical University and the Fraunhofer Institute of Dresden, offers OLED product manufacturers a proprietary technology, materials and expertise, and licenses and sells organic conductivity doping technology and materials for use in the commercial mass production of display products in the OLED industry.

Samsung Mobile Display Co., Ltd offers displays in AMOLED (Active Matrix Organic Light Emitting Diode) and LCD technologies.
TAG:Novaled SMD

Novaled expands agreement with Samsung Mobile Display

Novaled expands agreement with Samsung Mobile Display

MANHASSET, NY -- Novaled has entered into a multi-year licensing and purchase agreement with Samsung Mobile Display to provide dopant materials used in the transport layers of its AMOLED display modules from Novaled.

In addition, Novaled will provide its proprietary PIN OLED technology to SMD for use in the production of SMD’s AMOLED display modules.

The agreement is the latest between the two companies. Samsung has cooperated with Novaled in the field of technologies and materials for advanced OLED products since 2005.

“We are focused on developing innovative and state-of-the-art OLED technology, and so we have maintained a close cooperation with Novaled,” said S.I. Cho, President and CEO of Samsung Mobile Display, in a statement.

Novaled, founded in 2001 as a spin-off of the Technical University and the Fraunhofer Institute of Dresden, offers OLED product manufacturers a proprietary technology, materials and expertise, and licenses and sells organic conductivity doping technology and materials for use in the commercial mass production of display products in the OLED industry.

Samsung Mobile Display Co., Ltd offers displays in AMOLED (Active Matrix Organic Light Emitting Diode) and LCD technologies.
TAG:Novaled SMD

Newport Media gets the ISDB picture in smartphones

Newport Media gets the ISDB picture in smartphones


LONDON – Fabless chip company Newport Media Inc. (Lake Forest, Calif.) has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial (ISDB) transmissions which are standard in Latin American and Japanese markets.

Handset models available in Latin America include the Motorola EX139, LG X350 and the Samsung Galaxy YTV S5357 Android Smartphone. In Japan, network operators have selected several digital TV enabled Android Smartphones including the SC-06D Galaxy III from Samsung chosen by NTT Docomo, the ISW13HT from HTC chosen by KDDI and the 009Z from ZTE chosen by Softbank.

Newport Media provides products that integrate RF TV tuner, orthogonal frequency-division multiplexing (OFDM), and analog demodulation into a single die. Several ISDB-T chips from Newport Media also include hardware based H.264 audio/video decoding functionality.

"Newport Media offers a comprehensive portfolio of embedded software solutions tailored for both the Japanese and Latin American ISDB-T markets," said Mohy Abdelgany, president and chief executive officer for Newport Media. "These software solutions combined with wide variety of best in class SoC solutions from Newport Media have been a major contributing factor to our success with these new handsets being announced today, and are prime examples of the capabilities we bring to the table."

Newport Media has recently achieved cumulative shipments of more than 30 million CMOS SoCs that address the global market for ISDB-T standard broadcast mobile TV.


Related links and articles:

www.nmisemi.com

News articles:

Indian fabless startup seeks engineers, money

Q&A: Chip design not keeping pace in mobile

Patent snafus could delay new video codec





TAG:Newport Media NTT Docomo Samsung HTC Motorola ZTE Softbank KDDI ISDB DTV semiconductor mobile television

Newport Media gets the ISDB picture in smartphones

Newport Media gets the ISDB picture in smartphones


LONDON – Fabless chip company Newport Media Inc. (Lake Forest, Calif.) has won design slots for its digital television receiver SoCs in smartphones and feature phones from Samsung, HTC, LG, Motorola and ZTE. The chips are specifically for reception of Integrated Services Digital Broadcasting-Terrestrial (ISDB) transmissions which are standard in Latin American and Japanese markets.

Handset models available in Latin America include the Motorola EX139, LG X350 and the Samsung Galaxy YTV S5357 Android Smartphone. In Japan, network operators have selected several digital TV enabled Android Smartphones including the SC-06D Galaxy III from Samsung chosen by NTT Docomo, the ISW13HT from HTC chosen by KDDI and the 009Z from ZTE chosen by Softbank.

Newport Media provides products that integrate RF TV tuner, orthogonal frequency-division multiplexing (OFDM), and analog demodulation into a single die. Several ISDB-T chips from Newport Media also include hardware based H.264 audio/video decoding functionality.

"Newport Media offers a comprehensive portfolio of embedded software solutions tailored for both the Japanese and Latin American ISDB-T markets," said Mohy Abdelgany, president and chief executive officer for Newport Media. "These software solutions combined with wide variety of best in class SoC solutions from Newport Media have been a major contributing factor to our success with these new handsets being announced today, and are prime examples of the capabilities we bring to the table."

Newport Media has recently achieved cumulative shipments of more than 30 million CMOS SoCs that address the global market for ISDB-T standard broadcast mobile TV.


Related links and articles:

www.nmisemi.com

News articles:

Indian fabless startup seeks engineers, money

Q&A: Chip design not keeping pace in mobile

Patent snafus could delay new video codec





TAG:Newport Media NTT Docomo Samsung HTC Motorola ZTE Softbank KDDI ISDB DTV semiconductor mobile television

Marvell aims to be China chip leader

Marvell aims to be China chip leader


SHANGHAI, China – No, Marvell Technology is not moving to China.

However, the U.S. fabless chip company based in Santa Clara, Calif., has a goal to become “the largest semiconductor company in China,” according to a Marvell executive here. With 1,900 people already employed in China and the number climbing, the California- based company is clearly committed to its China aspirations, and already sees some of its goals within reach.

Earlier this year during an interview with EE Times, Weili Dai, Marvell’s Shanghai-born co-founder, went on record saying: “It’s important for us to stay in Silicon Valley. That’s where the entire eco-system of great talent and technologies resides.”

But that isn’t stopping Marvell from stretching a tentacle across the Pacific.

In addition to the company’s main design/engineering site in Shanghai – which employs some 1,600 people, Marvell is in the process of adding its second campus in Nanjing. The company is not disclosing details, but it acknowledges that it’s working with the local government. The new site is intended to be of a substantial size.

Marvell’s Chinese investments require little explanation. “Technology is moving very fast and China is a very dynamic market,” said Ting Wei Li, vice president and general manager, responsible for Marvell’s China business. “Everyone knows that there is a huge opportunity here, but to convert that opportunity to a real business, you need to be here.”

That includes Marvell getting engaged with leading telecom and TV operators and strategic partners in the system and service businesses in the local market. The ecosystem the chip company needs to work with is becoming increasingly local, moving very fast, and integrated with services, Wei Li explained.

He believes Marvell is in a good position to leverage the best of the both worlds: As a Silicon Valley-company where U.S. technology still leads, while being a local semiconductor company in China capable of responding to local needs quickly.

Wei Li noted that one area where the Chinese are deficient is documentation. “They’re not used to it.” He said designers and engineers need to be present at more meetings, listening carefully to what decision makers are saying, and need to be aware of new requirements as they emerge. “You need to stay connected,” said Wei Li.

800 engineers focused on mobile

Marvell in China is working on a number of different product segments today. They include smart TVs, set-tops; Universal Passive Optical Network (UPON) technology, which Marvell claims is the world's only single-chip solution that supports all three fiber media protocols, including EPON, Gigabit Passive Optical Network (GPON) and Active Ethernet; and mobile chips.

Of all these product lines, the mobile group commands the biggest presence in Marvell’s China operation, with 800 engineers now devoted to R&D in mobile products.

Although Marvell’s mobile chip business has had a great run and a slew of design-wins with Research In Motion’s Blackberry products, the chip company’s mobile momentum seems to have fizzled a little as RIM began getting squeezed out of the global smartphone market.

Mavell, however, claims that the company has a enough amunitions in reserve to regain its share. Driving the company’s renewed commitment in the mobile business are 800 engineers in China, 200 in the United States and 500 in Israel.

Following is an excerpt from a one-on-one interview EE Times conducted with Ivan Lee, vice president of mobile products at Marvell. He oversees development work both in China and in the United States.

EE Times: Why is Marvell’s mobile product team so spread out? And what’s the division of labor among those teams in different locations?

Ivan Lee: It’s largely for historical reasons. Our 500 people in Israel are largely coming from an Intel X-scale team that Marvell acquired in 2006. Their focus is on 3G, WCDMA development. Marvell’s success at getting design wins in RIM’s Blackberry was the work of our Israel team.

EE Times: What roles do your China and U.S. mobile teams play, then?

Lee: In China, our focus has been more on the TD-SCDMA work we started four years ago; and now more on TD-LTE development. Our mobile products team in China consists of: silicon designers; DSP designers; those who develop protocol stacks; software developers working on Android and other upper layers. Our 200 people in the U.S. include a SoC design team in Calif.; software engineers and Android development in Mass.; and a silicon validation team in Chandler, Arizona.

EE Times: You said Marvell’s 800 people responsible for mobile products in China are engaged in R&D. I find some people use the term very loosely. How do you define R&D?

Lee: The team here did everything from conceptualization of TD-SCDMA to its architectural development and production. I describe 99.9 percent of these 800 people as engaged in R&D.
Next: Marvell bets on LTE for mobile strategy
TAG:Marvell China Mobile TD SCDMA

Marvell aims to be China chip leader

Marvell aims to be China chip leader


SHANGHAI, China – No, Marvell Technology (Santa Clara, Calif.) is not moving to China.

However, the U.S. fabless chip company has a goal to become “the largest semiconductor company in China,” according to a Marvell executive here. With 1,900 people already employed in China and the number climbing, the California- based company is clearly committed to its China aspirations, and already sees some of its goals within reach.

Earlier this year during an interview with EE Times, Weili Dai, Marvell’s Shanghai-born co-founder, went on record saying: “It’s important for us to stay in Silicon Valley. That’s where the entire eco-system of great talent and technologies resides.”

But that isn’t stopping Marvell from stretching a tentacle across the Pacific.

In addition to the company’s main design/engineering site in Shanghai – which employs some 1,600 people, Marvell is in the process of adding its second campus in Nanjing. The company is not disclosing details, but it acknowledges that it’s working with the local government. The new site is intended to be of a substantial size.

Marvell’s Chinese investments require little explanation. “Technology is moving very fast and China is a very dynamic market,” said Ting Wei Li, vice president and general manager, responsible for Marvell’s China business. “Everyone knows that there is a huge opportunity here, but to convert that opportunity to a real business, you need to be here.”

That includes Marvell getting engaged with leading telecom and TV operators and strategic partners in the system and service businesses in the local market. The ecosystem the chip company needs to work with is becoming increasingly local, moving very fast, and integrated with services, Wei Li explained.

He believes Marvell is in a good position to leverage the best of the both worlds: As a Silicon Valley-company where U.S. technology still leads, while being a local semiconductor company in China capable of responding to local needs quickly.

Wei Li noted that one area where the Chinese are deficient is documentation. “They’re not used to it.” He said designers and engineers need to be present at more meetings, listening carefully to what decision makers are saying, and need to be aware of new requirements as they emerge. “You need to stay connected,” said Wei Li.

Marvell in China is working on a number of different product segments today. They include smart TVs, set-tops; Universal Passive Optical Network (UPON) technology, which Marvell claims is the world's only single-chip solution that supports all three fiber media protocols, including EPON, Gigabit Passive Optical Network (GPON) and Active Ethernet; and mobile chips.

Of all these product lines, the mobile group commands the biggest presence in Marvell’s China operation, with 800 engineers now devoted to R&D in mobile products.

Although Marvell’s mobile chip business has had a great run and a slew of design-wins with Research In Motion’s Blackberry products, the chip company’s mobile momentum seems to have fizzled a little as RIM began getting squeezed out of the global smartphone market.

Mavell, however, claims that the company has a enough amunitions in reserve to regain its share. Driving the company’s renewed commitment in the mobile business are 800 engineers in China, 200 in the United States and 500 in Israel.

Following is an excerpt from a one-on-one interview EE Times conducted with Ivan Lee, vice president of mobile products at Marvell. He oversees development work both in China and in the United States.

EE Times: Why is Marvell’s mobile product team so spread out? And what’s the division of labor among those teams in different locations?

Ivan Lee: It’s largely for historical reasons. Our 500 people in Israel are largely coming from an Intel X-scale team that Marvell acquired in 2006. Their focus is on 3G, WCDMA development. Marvell’s success at getting design wins in RIM’s Blackberry was the work of our Israel team.

EE Times: What roles do your China and U.S. mobile teams play, then?

Lee: In China, our focus has been more on the TD-SCDMA work we started four years ago; and now more on TD-LTE development. Our mobile products team in China consists of: silicon designers; DSP designers; those who develop protocol stacks; software developers working on Android and other upper layers. Our 200 people in the U.S. include a SoC design team in Calif.; software engineers and Android development in Mass.; and a silicon validation team in Chandler, Arizona.

EE Times: You said Marvell’s 800 people responsible for mobile products in China are engaged in R&D. I find some people use the term very loosely. How do you define R&D?

Lee: The team here did everything from conceptualization of TD-SCDMA to its architectural development and production. I describe 99.9 percent of these 800 people as engaged in R&D.
Next: Marvell bets on LTE for mobile strategy
TAG:Marvell China Mobile TD SCDMA

2012-06-28

On Qualcomm manufacturing options

On Qualcomm manufacturing options


So Paul Jacobs CEO of Qualcomm Inc. (San Diego, Calif.) doesn't rule out owning the means of chip production? (see Qualcomm wafer fab not ruled out).

Although Qualcomm, as fifth largest chip company, has about $6 billion of cash on hand, I don't think Jacob's reported sentiment means that Qualcomm is going to leave the ranks of the fabless any time soon. There are many ways to finesse ownership issues and almost all of them will be about partnership and finding common ground.

So for me this disclosure is more about the likes of Globalfoundries, Samsung and Intel, versus Taiwan Semiconductor Manufacturing Co. Ltd. and playing one of against another than it is about the creation of the Qualcomm Semiconductor Manufacturing Company.

Such is the long lead-time and high expense of bring up wafer fabs – typically between $5 billion and $10 billion at today's leading-edge – it is almost impossible to think Qualcomm would start from scratch on chip manufacturing.

An alternative would be for Qualcomm to buy all or a part-share in an existing wafer fab that can produce its processors. Some chip manufacturers are struggling for profitability and might be willing to cut a deal, although most of the chip companies able to manufacture at 28-nm and 20-nm are in a more profitable situation. Nonetheless at the leading-edge capital expenditure is ferocious and Qualcomm has been piling up the cash and has interest in changing a situation that has left it short of chips and disappointing customers.

Another more likely possibility is that Qualcomm would be asked to put a significant amount of cash down to reserve a proportion of the output of an existing leading-edge wafer fab's output. Such part equity, part pre-payment deals have existed in the past although the circumstances that have driven their creation have not always been long-lived. And Jacob's himself has said that the 28-nm chip supply situation is improving and Qualcomm would hope to be meeting customers' requirements by the end of 2012.

So if Jacob's musings are about partnership who is he thinking about partnering with?
Next: Samsung or Globalfoundries
TAG:Paul Jacobs Qualcomm Samsung Globalfoundries TSMC Apple semiconductor foundry

Report: Qualcomm wafer fab not ruled out

Report: Qualcomm wafer fab not ruled out


LONDON – Paul Jacobs, CEO of Qualcomm Inc. (San Dieo, Calif.), the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.

Qualcomm has suffered a shortage of 28-nm Snapdragon processors from its foundry partner, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and has said this lack of supply will constrain earnings growth in the second and third quarters of the year.

Qualcomm is considering its manufacturing options and would consider "writing big checks" to chip suppliers, the report quoted Jacobs as saying during a briefing in San Diego. Jacobs added that Qualcomm would prefer to remain fabless and not build its own wafer fabs, but that if it was advantageous to own the means of production in the future Qualcomm could do it, the report said.

"It's not something that's high on our list of things that we want to do. But I wouldn't rule it out completely," the report quoted Jacobs as saying.

In April when the TSMC shortage was revealed Qualcomm said it was turning to other foundry suppliers and more recently it has been reported that Jacobs has visited Samsung Electronics Co. Ltd. to discuss the possibility of Samsung making chips for Qualcomm. Intel has also been suggested as a possible foundry for Qualcomm. However, the fact that Intel and Samsung both compete with Qualcomm in the supply of processors for smartphones and tablet computers, would count against them becoming suppliers.

The 28-nm chip supply situation is easing but some Qualcomm customers may have to delay smartphone product launches, the report quoted Jacobs as saying.


Related links and articles:

Qualcomm engages other foundries amid 28-nm capacity shortage

ST opens up 28-nm, 20-nm FDSOI with GlobalFoundries

Intel says 25% of shipments will be on 22-nm in Q2

Qualcomm moves to No. 5 in chip sales


TAG:Paul Jacobs wafer fab Qualcomm Samsung Intel UMC TSMC foundry semiconductor Snapdragon

Report: Qualcomm wafer fab not ruled out

Report: Qualcomm wafer fab not ruled out


LONDON – Paul Jacobs, CEO of Qualcomm Inc. (San Dieo, Calif.), the world's largest fabless chip company, has not ruled out owning a wafer fab or putting large amounts of cash down to ensure the firm's supply of semiconductor chips, according to a Bloomberg report.

Qualcomm has suffered a shortage of 28-nm Snapdragon processors from its foundry partner, Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC) and has said this lack of supply will constrain earnings growth in the second and third quarters of the year.

Qualcomm is considering its manufacturing options and would consider "writing big checks" to chip suppliers, the report quoted Jacobs as saying during a briefing in San Diego. Jacobs added that Qualcomm would prefer to remain fabless and not build its own wafer fabs, but that if it was advantageous to own the means of production in the future Qualcomm could do it, the report said.

"It's not something that's high on our list of things that we want to do. But I wouldn't rule it out completely," the report quoted Jacobs as saying.

In April when the TSMC shortage was revealed Qualcomm said it was turning to other foundry suppliers and more recently it has been reported that Jacobs has visited Samsung Electronics Co. Ltd. to discuss the possibility of Samsung making chips for Qualcomm. Intel has also been suggested as a possible foundry for Qualcomm. However, the fact that Intel and Samsung both compete with Qualcomm in the supply of processors for smartphones and tablet computers, would count against them becoming suppliers.

The 28-nm chip supply situation is easing but some Qualcomm customers may have to delay smartphone product launches, the report quoted Jacobs as saying.


Related links and articles:

Qualcomm engages other foundries amid 28-nm capacity shortage

ST opens up 28-nm, 20-nm FDSOI with GlobalFoundries

Intel says 25% of shipments will be on 22-nm in Q2

Qualcomm moves to No. 5 in chip sales


TAG:Paul Jacobs wafer fab Qualcomm Samsung Intel UMC TSMC foundry semiconductor Snapdragon

U-blox makes LTE move, buys Cognovo and 4M Wireless

U-blox makes LTE move, buys Cognovo and 4M Wireless


LONDON – GPS and wireless chip company U-blox AG (Thalwil, Switzerland) has acquired startup LTE chip company Cognovo (Cambridge, England) for $16.5 million.

The move follows the announcement of the planned acquisition by U-blox of another significant LTE company 4M Wireless Ltd. (Luton, England) in April. The price to purchase 4M Wireless was given as $9 million. 4M Wireless is a leading developer of communications protocols based on the 3GPP Long Term Evolution (LTE) standards.

4M Wireless has licensed a number of companies to use its protocol stacks including Blue Wonder Communications now part of Intel, Wintegra acquired by PMC-Sierra, Sandbridge Technologies acquired by Wuxi DSP, Ceva, Tensilica, MIPS Technologies Inc. At the most recent Mobile World Congress in February 2012 Cognovo demonstrated an LTE protocol stack running 4G cellular communications on its SDM baseband chip.

4M Wireless, with more than 50 employeers, is headquartered in the U.K. with an engineering office in Pakistan. The 4M Wireless deal is expected to close by September 2012 while the Cognovo deal has been completed.

Cognovo, with 30 employees and investment from ARM Holdings plc, was engaged in soft-modem chip development. Its acquisition extends U-blox' ability to create products that require 4G communications combined with global positioning.

U-blox said it intends to combine the technologies of Cognovo and 4M Wireless to create a wireless modem platform based on wholly-owned IP.

"This allows us to meet market demand for connected systems that require positioning, connectivity and application-specific functionality on a single integrated circuit," said Thomas Seiler, CEO of U-blox, in a statement. "This new foundation broadens our serviceable market, and will increase our margins in the automotive, consumer and industrial sectors. Our first 4G product is planned for 2013."

"With over 300 man-years of R&D invested in our SDM technology, this acquisition brings together the industry's most advanced software modem development platform with some of the best IC design and GNSS engineers in the world," said Gordon Aspin, CEO of Cognovo, in the same statement.

Founded in 1997, u-blox is listed on the SIX Swiss Exchange.

4M Wireless, founded in 2006, entered the Silicon 60, EE Times' list of emerging startup companies at version 12.5 in April 2011. Cognovo, founded in 2009, entered the Silicon 60 at version 10.0 in April 2010. The latest edition of the Silicon 60 is version 13.0 which can be found at http://confidential.eetimes.com/analysis-reports/4371437/EE-Times-60-Emerging-Startups


Related links and articles:

www.u-blox.com

News articles:


4M Wireless licenses LTE protocol stack to Wuxi DSP

Wintegra, 4M Wireless team for LTE interoperability

4M ports LTE stack to Tensilica, Blue Wonder

Cognovo modem tape-out sent to Samsung

ARM boosted startup with Belgian DSP

TTPcom four move on to form Cognovo










TAG:4M Wireless U blox Cognovo 3GPP LTE 4G mobile modem software semiconductor communications cellular

U-blox makes LTE move, buys Cognovo and 4M Wireless

U-blox makes LTE move, buys Cognovo and 4M Wireless


LONDON – GPS and wireless chip company U-blox AG (Thalwil, Switzerland) has acquired startup LTE chip company Cognovo (Cambridge, England) for $16.5 million.

The move follows the announcement of the planned acquisition by U-blox of another significant LTE company 4M Wireless Ltd. (Luton, England) in April. The price to purchase 4M Wireless was given as $9 million. 4M Wireless is a leading developer of communications protocols based on the 3GPP Long Term Evolution (LTE) standards.

4M Wireless has licensed a number of companies to use its protocol stacks including Blue Wonder Communications now part of Intel, Wintegra acquired by PMC-Sierra, Sandbridge Technologies acquired by Wuxi DSP, Ceva, Tensilica, MIPS Technologies Inc. At the most recent Mobile World Congress in February 2012 Cognovo demonstrated an LTE protocol stack running 4G cellular communications on its SDM baseband chip.

4M Wireless, with more than 50 employeers, is headquartered in the U.K. with an engineering office in Pakistan. The 4M Wireless deal is expected to close by September 2012 while the Cognovo deal has been completed.

Cognovo, with 30 employees and investment from ARM Holdings plc, was engaged in soft-modem chip development. Its acquisition extends U-blox' ability to create products that require 4G communications combined with global positioning.

U-blox said it intends to combine the technologies of Cognovo and 4M Wireless to create a wireless modem platform based on wholly-owned IP.

"This allows us to meet market demand for connected systems that require positioning, connectivity and application-specific functionality on a single integrated circuit," said Thomas Seiler, CEO of U-blox, in a statement. "This new foundation broadens our serviceable market, and will increase our margins in the automotive, consumer and industrial sectors. Our first 4G product is planned for 2013."

"With over 300 man-years of R&D invested in our SDM technology, this acquisition brings together the industry's most advanced software modem development platform with some of the best IC design and GNSS engineers in the world," said Gordon Aspin, CEO of Cognovo, in the same statement.

Founded in 1997, u-blox is listed on the SIX Swiss Exchange.

4M Wireless, founded in 2006, entered the Silicon 60, EE Times' list of emerging startup companies at version 12.5 in April 2011. Cognovo, founded in 2009, entered the Silicon 60 at version 10.0 in April 2010. The latest edition of the Silicon 60 is version 13.0 which can be found at http://confidential.eetimes.com/analysis-reports/4371437/EE-Times-60-Emerging-Startups


Related links and articles:

www.u-blox.com

News articles:


4M Wireless licenses LTE protocol stack to Wuxi DSP

Wintegra, 4M Wireless team for LTE interoperability

4M ports LTE stack to Tensilica, Blue Wonder

Cognovo modem tape-out sent to Samsung

ARM boosted startup with Belgian DSP

TTPcom four move on to form Cognovo










TAG:4M Wireless U blox Cognovo 3GPP LTE 4G mobile modem software semiconductor communications cellular

Nordic streamlines code in latest RF chips

Nordic streamlines code in latest RF chips

OSLO – Nordic Semiconductor ASA announced the first members of a new family of 2.4 GHz RF chips that take a fresh approach to supporting multiple protocols. The nRF51 series separates protocol and application software stacks, letting developers write apps code on embedded ARM Cortex-M0 cores rather than require software frameworks specific to the chip vendor.

Nordic claims the approach will shorten time-to-market by easing the job of writing software. It also claims the components slash power consumption as much as 50 percent, provide a ten-fold boost in processing performance and a 9.5 dB increase in RF link budget compared to Nordic’s previous parts.

The use of the Cortex-M0 core is a big step up for Nordic which traditionally used 8051-compatible controllers, said Will Strauss, principal of market watcher Forward Concepts (Tempe, Ariz.).

The first two chips in the family are the nRF51822 supporting Bluetooth Low Energy or proprietary protocols and the nRF51422 for the ANT protocol. The hardware for the two chips is identical and includes 256 kilobytes flash and 16 kbytes RAM in a 6mm2 48-pin QFN package.

Nordic will deliver Bluetooth and ANT protocol stacks as a pre-compiled binary or pre-programmed on the devices. The software runs in an asynchronous and event driven manner and includes APIs to the application layer, the company said.

In addition, protocol stacks and application code have no link-time dependencies and can be compiled and updated separately, Nordic said. A custom two-region memory protection unit helps enforce the separation of protocol and apps code. The separation ensures any application layer bugs will not affect the protocol software, the company added.

The nRF51822 comes with a Bluetooth low energy stack including profiles, services, and example applications provided as a downloadable, royalty-free, pre-compiled binary. It requires less than 128 kilobytes of code space and 6 kilobytes of RAM.

The chip also comes with an updated version of Nordic’s Gazell protocol stack. The software is backward compatible with Gazell applications on its existing nRF24L chips and cuts power consumption by 30 percent.

The nRF51422 includes software implementing the ANT protocol stack, ANT+ profiles and example applications. It supports up to eight concurrent ANT channels and requires less than 32 kilobytes of code space and 2 kilobytes of RAM.

Nordic was early to adopt the ANT protocol which enables even lower power consumption levels than Bluetooth Low Energy, said Strauss.

The chips are aimed at a wide range of PC peripherals, connected TV remote controls, toys, automated controls and sports, fitness and health care sensors. They are compatible with Nordic's existing nRF24L series

The new series is in limited sampling now with general availability in early September. Volume production is expected before the end of the year.
TAG:Bluetooth Low Energy Nordic Semiconductor 2 4 GHz Nordic RF Bluetooth ANT Protocols Wireless

Legislation seeks to relax restrictions on tracking fake chips

Legislation seeks to relax restrictions on tracking fake chips

WASHINGTON – Three lawmakers have proposed legislation aimedat stemming the flow of counterfeit semiconductors into the U.S., a growingthreat to the nation’s national security and critical infrastructure.

The legislation introduced by Reps. Michael McCaul(R-Texas), Howard McKeon (R-Texas) and William Keating (D-Mass.) seeks toreverse the U.S. Customs and Border Protection’s policy that limits chip makers’access to photographs of trademarks on suspected fake chips. H.R. 6012 wouldagain allow chip makers to examine photographs showing identifying informationon suspect chips to determine their authenticity.

The bill’s sponsors said the legislation is designed to stopthe flow of more than 1 million counterfeit chips into the U.S. thatinvestigators suspect are primarily made in China. More than 2 millioncounterfeit or mislabeled chips entered the U.S. in 2010, the lawmakers said.One technique involves salvaging and repackaging chips from discardedelectronic equipment.

“From brake systems and defibrillators to advanced militaryweapon systems, when a product fails because of a counterfeit chip, the consequencescan be catastrophic,” McKeon said in a statement introducing the legislation. “Thisbill will fundamentally improve our efforts to stop the dangerous flow ofcounterfeit chips onto our shores.”

McKeon is chairman of the House Armed Services Committee.McCaul is chairman of the House Homeland Security Oversight &Investigations subcommittee.

A recent investigation by the Senate Armed Services Committee revealed that fake chips had turned up in several U.S. weapons,including the Navy’s SH-60B Seahawk helicopter and the P8-A antisubmarinewarfare aircraft.

Industry groups like the Semiconductor Industry Associationpraised the legislation, calling the spread of counterfeit chips in weapons,networks and medical devices a “ticking time bomb.”

The proposed legislation will initially be considered by theHouse Judiciary Committee since it raises issues about intellectual propertyrights. With lawmakers heading home for vacation later this week and a generalelection looming in the fall, it is unlikely the legislation would make it outof the committee by the end of the current congressional session.

Related stories:

Report reveals fake chips in U.S. military hardware

Ferreting out the fake in the chip supply chain

Chip counterfeiting case exposes defense supply chain flaw


TAG:Counterfeit Chips Fake Chips Legislation China Semiconductors

Legislation seeks to relax restrictions on tracking fake chips

Legislation seeks to relax restrictions on tracking fake chips

WASHINGTON – Three lawmakers have proposed legislation aimedat stemming the flow of counterfeit semiconductors into the U.S., a growingthreat to the nation’s national security and critical infrastructure.

The legislation introduced by Reps. Michael McCaul(R-Texas), Howard McKeon (R-Texas) and William Keating (D-Mass.) seeks toreverse the U.S. Customs and Border Protection’s policy that limits chip makers’access to photographs of trademarks on suspected fake chips. H.R. 6012 wouldagain allow chip makers to examine photographs showing identifying informationon suspect chips to determine their authenticity.

The bill’s sponsors said the legislation is designed to stopthe flow of more than 1 million counterfeit chips into the U.S. thatinvestigators suspect are primarily made in China. More than 2 millioncounterfeit or mislabeled chips entered the U.S. in 2010, the lawmakers said.One technique involves salvaging and repackaging chips from discardedelectronic equipment.

“From brake systems and defibrillators to advanced militaryweapon systems, when a product fails because of a counterfeit chip, the consequencescan be catastrophic,” McKeon said in a statement introducing the legislation. “Thisbill will fundamentally improve our efforts to stop the dangerous flow ofcounterfeit chips onto our shores.”

McKeon is chairman of the House Armed Services Committee.McCaul is chairman of the House Homeland Security Oversight &Investigations subcommittee.

A recent investigation by the Senate Armed Services Committee revealed that fake chips had turned up in several U.S. weapons,including the Navy’s SH-60B Seahawk helicopter and the P8-A antisubmarinewarfare aircraft.

Industry groups like the Semiconductor Industry Associationpraised the legislation, calling the spread of counterfeit chips in weapons,networks and medical devices a “ticking time bomb.”

The proposed legislation will initially be considered by theHouse Judiciary Committee since it raises issues about intellectual propertyrights. With lawmakers heading home for vacation later this week and a generalelection looming in the fall, it is unlikely the legislation would make it outof the committee by the end of the current congressional session.

Related stories:

Report reveals fake chips in U.S. military hardware

Ferreting out the fake in the chip supply chain

Chip counterfeiting case exposes defense supply chain flaw


TAG:Counterfeit Chips Fake Chips Legislation China Semiconductors

U.S., European manufacturers join forces to compete with China

U.S., European manufacturers join forces to compete with China



APPLETON, Wis. – In March, the Swiss electronics manufacturing services company Escatec announced a partnership with a small, up-and-coming contract manufacturer here called Surface Mount Technology Corp. By itself, the deal was merely one of many announced each month in the electronics industry. Viewed from another angle, however, the Escatec-SMT deal underscores the global nature of electronics production at a time when competitiveness along with high-tech manufacturing jobs have become key issues in reviving the tightly linked U.S. and European economies.

The deal made sense since Escatec was looking for a North American manufacturing partner to gain a foothold in the region while gaining another “gateway” to its high-volume manufacturing operations in Penang, Malaysia. Martin Kingdon, Escatec’s director of business development, added that it also allowed the Swiss EMS to move up the value chain by providing R&D and design services closer to its North American customers.

SMT, which specializes in low- to medium-volume contract manufacturing for underserved smaller companies, expanded its customer base through the deal and gained the ability to offer higher-volume contract manufacturing through Escatec’s Malaysia operation.


What is significant in this picture of Surface Mount Technology's shop floor is the fact that the back wall is temporary, allowing for quick expansion when more work comes in.

TAG:Surface Mount Technology Electronics Manufacturing Services Escatec EMS China Manufacturing

U.S., European manufacturers join forces to compete with China

U.S., European manufacturers join forces to compete with China



APPLETON, Wis. – In March, the Swiss electronics manufacturing services company Escatec announced a partnership with a small, up-and-coming contract manufacturer here called Surface Mount Technology Corp. By itself, the deal was merely one of many announced each month in the electronics industry. Viewed from another angle, however, the Escatec-SMT deal underscores the global nature of electronics production at a time when competitiveness along with high-tech manufacturing jobs have become key issues in reviving the tightly linked U.S. and European economies.

The deal made sense since Escatec was looking for a North American manufacturing partner to gain a foothold in the region while gaining another “gateway” to its high-volume manufacturing operations in Penang, Malaysia. Martin Kingdon, Escatec’s director of business development, added that it also allowed the Swiss EMS to move up the value chain by providing R&D and design services closer to its North American customers.

SMT, which specializes in low- to medium-volume contract manufacturing for underserved smaller companies, expanded its customer base through the deal and gained the ability to offer higher-volume contract manufacturing through Escatec’s Malaysia operation.


What is significant in this picture of Surface Mount Technology's shop floor is the fact that the back wall is temporary, allowing for quick expansion when more work comes in.

TAG:Surface Mount Technology Electronics Manufacturing Services Escatec EMS China Manufacturing

2012-06-27

Indian fabless startup seeks $20 million, say reports

Indian fabless startup seeks $20 million, say reports


LONDON – Fabless mobile computing chip company Ineda Systems Pvt Ltd. (Hyderabad, India) is planning to raise $20 million over the next few months, according to local reports. The company is also busy recruiting hardware and software engineers.

The company, founded in 2010 by Balaji Kanigicherla, has 150 engineers and plans to add 50 more in the next six to eight months, a Business Standard report said, adding that Ineda plans to launch three products by 2013 aimed at smartphones, tablet computers, and laptop computers.

The use of the term platform implies that Ineda will bundle software, firmware and application processor SoC and equipment-level design together to provide OEM customers with a fast route to producing a mobile computing device.

Ineda claims to have a novel system architecture working in FPGA prototype form that can improve the power/performance metrics by an order of magnitude compared with existing system architectures. The company is reported to have a portfolio of 28 patents granted or pending.

LinkedIn listed engineers have IC design experience with such companies as Broadcom, NVidia, Soctronics, ST-Ericsson, Texas Instruments, Wipro, PortalPlayer. The company is looking for more engineers familiar with SoC synthesis, verification and physical design and software engineers that can write a BIOS and driver software for Windows, Linux and Android systems.

The Business Standard reported Kanigicherla, founder and CEO, as saying that Ineda is in discussion with potential investors including venture capitalists, private equity firms and individual investors but that it was looking to raise the money in the form of debt.

"Currently, the products are in the prototype stage. The manufacturing will be done by some semiconductor fab companies in Taiwan," the Business Standard quoted Kanigicherla, as saying.


Related links and articles:

www.inedasystems.com

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India's Soctronics claims 28-nm design win

Virtual jobs fair offers engineers work in Singapore

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TAG:India Ineda mobile computing semiconductor platform smartphone tablet computer ultrabook

Indian fabless startup seeks $20 million, say reports

Indian fabless startup seeks $20 million, say reports


LONDON – Fabless mobile computing chip company Ineda Systems Pvt Ltd. (Hyderabad, India) is planning to raise $20 million over the next few months, according to local reports. The company is also busy recruiting hardware and software engineers.

The company, founded in 2010 by Balaji Kanigicherla, has 150 engineers and plans to add 50 more in the next six to eight months, a Business Standard report said, adding that Ineda plans to launch three products by 2013 aimed at smartphones, tablet computers, and laptop computers.

The use of the term platform implies that Ineda will bundle software, firmware and application processor SoC and equipment-level design together to provide OEM customers with a fast route to producing a mobile computing device.

Ineda claims to have a novel system architecture working in FPGA prototype form that can improve the power/performance metrics by an order of magnitude compared with existing system architectures. The company is reported to have a portfolio of 28 patents granted or pending.

LinkedIn listed engineers have IC design experience with such companies as Broadcom, NVidia, Soctronics, ST-Ericsson, Texas Instruments, Wipro, PortalPlayer. The company is looking for more engineers familiar with SoC synthesis, verification and physical design and software engineers that can write a BIOS and driver software for Windows, Linux and Android systems.

The Business Standard reported Kanigicherla, founder and CEO, as saying that Ineda is in discussion with potential investors including venture capitalists, private equity firms and individual investors but that it was looking to raise the money in the form of debt.

"Currently, the products are in the prototype stage. The manufacturing will be done by some semiconductor fab companies in Taiwan," the Business Standard quoted Kanigicherla, as saying.


Related links and articles:

www.inedasystems.com

News articles:

India's Soctronics claims 28-nm design win

Virtual jobs fair offers engineers work in Singapore

Indian tablet for education project in fresh controversy

TAG:India Ineda mobile computing semiconductor platform smartphone tablet computer ultrabook

Displayport, HDMI duel over mobile links

Displayport, HDMI duel over mobile links

SAN JOSE – A new battle has broken out over how to bring high def video to mobile devices.

The Video Electronics Standards Association (VESA) formally announced Mobility DisplayPort (MyDP) today, a new competitor for Silicon Image’s MHL high-definition video interconnect. Analogix has discrete chips for the spec, STMicroelectronics is said to be planning them and vendors of mobile applications processors are expected to integrate the technology in future SoCs.

MyDP is based on DisplayPort 1.2, a 5.4 Gbit/s max link now used in a wide range of products to support up to 1920 x 1080-progressive resolution video at 60 Hz with 24 bit color. It also supports the 1.1a version at 2.7 Gbits/s that delivers 720p video.

The link supports power so phones can charge while sending video. It uses the existing micro USB connectors on handsets.

Analogix has developed a discrete bridge chip supporting MyDP and linking to HDMI interfaces in existing mobile apps processors. It delivers 1080p video while consuming less than 300 milliwatts for both the transmitter and bridge and adds less than two dollars to the bill of materials, said Andre Bouwer, vice president of marketing at Analogix.

Bouwer expects MyDP will find its way into handsets, TVs, notebooks and--using a Mbit/s sideband channel--links to keyboards and mice as handsets become used as mobile PC replacements in the next several years. It also supports audio and stereo 3-D for 1080p at 30 Hz per eye as well as adapters to connect to existing DVI and VGA interfaces.

VESA created an online video demonstrating MyDP at the Consumer Electronics Show.

The new link arrives at a time when Silicon Image claims its MHL, a mobile variant of HDMI, is already enabled in 50 million devices including handsets from more than a dozen vendors including HTC, LG and Samsung and TVs from LG, Samsung, Sharp and Toshiba. The MHL group—which includes chip makers such as Mediatek, Mstar, Texas Instruments and Qualcomm--expects more than 100 million MHL-enabled devices will ship this year.

The original MHL spec only supported 1080p video at 30 Hz, consumed as much as 800 milliwatts and did not support power over the link. Thus handsets could find their batteries drained before they finished a two-hour movie, said Bouwer of Analogix.

In May, Silicon Image announced MHL 2.0 supporting full 1080p video at 60 Hz at as little as 30 milliwatts. The new link also supports power and micro USB connectors.

Silicon Image is not disclosing who has licensed the new core so far or when it might find its way into products.

So the battle is on for who will supply the next-generation high def interconnect for handsets and other consumer systems. The winner likely will emerge in a year or two as mobile apps processors decide which technology they will support in their next-generation chips.



TAG:Mobility Displayport Silicon Image MyDP Displayport MHL Interconnects Video Smartphones Handsets VESA

Displayport, HDMI duel over mobile links

Displayport, HDMI duel over mobile links

SAN JOSE – A new battle has broken out over how to bring high def video to mobile devices.

The Video Electronics Standards Association (VESA) formally announced Mobility DisplayPort (MyDP) today, a new competitor for Silicon Image’s MHL high-definition video interconnect. Analogix has discrete chips for the spec, STMicroelectronics is said to be planning them and vendors of mobile applications processors are expected to integrate the technology in future SoCs.

MyDP is based on DisplayPort 1.2, a 5.4 Gbit/s max link now used in a wide range of products to support up to 1920 x 1080-progressive resolution video at 60 Hz with 24 bit color. It also supports the 1.1a version at 2.7 Gbits/s that delivers 720p video.

The link supports power so phones can charge while sending video. It uses the existing micro USB connectors on handsets.

Analogix has developed a discrete bridge chip supporting MyDP and linking to HDMI interfaces in existing mobile apps processors. It delivers 1080p video while consuming less than 300 milliwatts for both the transmitter and bridge and adds less than two dollars to the bill of materials, said Andre Bouwer, vice president of marketing at Analogix.

Bouwer expects MyDP will find its way into handsets, TVs, notebooks and--using a Mbit/s sideband channel--links to keyboards and mice as handsets become used as mobile PC replacements in the next several years. It also supports audio and stereo 3-D for 1080p at 30 Hz per eye as well as adapters to connect to existing DVI and VGA interfaces.

VESA created an online video demonstrating MyDP at the Consumer Electronics Show.

The new link arrives at a time when Silicon Image claims its MHL, a mobile variant of HDMI, is already enabled in 50 million devices including handsets from more than a dozen vendors including HTC, LG and Samsung and TVs from LG, Samsung, Sharp and Toshiba. The MHL group—which includes chip makers such as Mediatek, Mstar, Texas Instruments and Qualcomm--expects more than 100 million MHL-enabled devices will ship this year.

The original MHL spec only supported 1080p video at 30 Hz, consumed as much as 800 milliwatts and did not support power over the link. Thus handsets could find their batteries drained before they finished a two-hour movie, said Bouwer of Analogix.

In May, Silicon Image announced MHL 2.0 supporting full 1080p video at 60 Hz at as little as 30 milliwatts. The new link also supports power and micro USB connectors.

Silicon Image is not disclosing who has licensed the new core so far or when it might find its way into products.

So the battle is on for who will supply the next-generation high def interconnect for handsets and other consumer systems. The winner likely will emerge in a year or two as mobile apps processors decide which technology they will support in their next-generation chips.



TAG:Mobility Displayport Silicon Image MyDP Displayport MHL Interconnects Video Smartphones Handsets VESA

CEA-Leti preps for PCM, HKMG research below 20-nm

CEA-Leti preps for PCM, HKMG research below 20-nm


LONDON – Soitec SA (Bernin, France), a vendor of silicon-on-insulator wafers, has announced that its subsidiary Altatech Semiconductor SA has installed an chemical vapor deposition system at the research institute CEA-Leti in Grenoble, France. CEA-Leti will use the AltaCVD machine to develop phase-change memory (PCM) devices and high-k metal gate (HKMG) structures for the sub-20nm technology node, Soitec said.

Soitec acquired Altatech earlier in 2012 and this is the first equipment order received by Altatech since it became a subsidiary of Soitec.

CEA-Leti plans to use the AltaCVD machine to perform low-temperature deposition of binary and ternary alloys as part of an optimization of phase-change memory properties. The machine can create thin films with thicknesses of 100-nm or less with precise stoichiometry. This ability to deposit advanced materials with very high uniformity and repeatability also will be used by CEA-Leti in creating high-k metal gates.

The machine is capable of accommodating 200-mm or 300-mm diameter wafers and is a multi-chamber tool designed for plasma-enhanced or metal-organic deposition of advanced semiconductor materials using liquid precursors.

"Following the release of our advanced CVD systems for front-end and memory processing and the roll out of our deposition tools for TSV [through-silicon-via] isolation and conductive layers, we are now applying our proven technology in creating advanced memories and high-k metal gates," said Jean-Luc Delcarri, general manager of Altatech, in a statement issued by Soitec.

Soitec made a net loss of 56.3 million euro (about $70 million) on sales revenue of 323.4 million euro (about $400 million) in the financial year to March 31, 2012.


Related links and articles:

www.soitec.com

www.altatech.com

www.cea-leti.fr

News articles:


Soitec to acquire Alatech Semi

ST, ST-Ericsson commit to SOI, says Soitec


French parallel processing research wins $40 million

ST opens up 28-nm, 20-nm FDSOI with GlobalFoundries


TAG:phase change memory CEA Leti PCM HKMG Soitec Altatech AltaCVD semiconductor

Infineon lowers guidance as business softens

Infineon lowers guidance as business softens


LONDON – Infineon Technologies AG (Munich, Germany) has updated its outlook for the third and fourth quarters of its 2012 fiscal year.

For the current, third fiscal quarter, which ends on June 30, Infineon now expects a slight decline in revenues compared to the second quarter and total segment result margin of about 12 percent. Previously Infineon had predicted sales and margin would be about the same as in the second fiscal quarter when the total segment result margin was 14.6 percent.

Infineon said that global economic uncertainties had led to softer than expected operating business for the company that was not fully compensated for by strength in the exchange rate of the U.S. dollar to the euro.

For the fourth quarter of the 2012 fiscal year, Infineon expects revenues and total segment result margin to be broadly flat compared to the third quarter of the 2012 fiscal year. The third calendar quarter of the year usually shows strong sequential growth.

Infineon said it will provide additional detail on the current quarter and the outlook for the fourth quarter when reporting the results for the third quarter of the 2012 fiscal year on July 31, 2012.


Related links and articles:

www.infineon.com

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TAG:Infineon guidance financial semiconductor

Court halts U.S. sales of Samsung's Galaxy Tab 10.1

Court halts U.S. sales of Samsung's Galaxy Tab 10.1

PARIS - A U.S. judge on Tuesday backed Apple Inc's request to stop Samsung Electronics selling its Galaxy Tab 10.1 tablet in the United States, Reuters reported.

The decision issued by U.S. District Judge Lucy Koh in San Jose, California gives Apple a significant win in the global smartphone and tablet patent wars.

Samsung's Galaxy touchscreen tablets, based on Google's Android operating system, have been going head to head against the iPad especially in Asia, although Android made little dent on the U.S. tablet market. Meanwhile, Microsoft and Google are also preparing tablet offerings.

The Tuesday decision, however, is by no means the last word on Google’s Android vs. Apple case. The latest injunction against Samsung comes less than a week after a federal judge in Chicago dismissed Apple's patent claims against Google's Motorola Mobility unit.

Expect further scuttlebutt in different territories in months to come.

Judge Koh in San Jose, California, had previously denied Apple's bid for an injunction on the tablet and multiple Galaxy smartphones. However, a federal appeals court instructed Koh to reconsider Apple's request on the tablet.

The court’s order to halt Galxy Tab sales should become effective, according to Reuters, once Apple posts a $2.6 million bond to protect against damages suffered by Samsung if the injunction is later found to have been wrong.



TAG:Apple Samsung Android Google Court Galaxy Tab 10 1

2x2mm MEMS microphones delivered in tough plastic packages

2x2mm MEMS microphones delivered in tough plastic packages

STMicroelectronics' novel microphone-assembly process ensures superior electrical and acoustic performance, unbeatable mechanical robustness, and slimmer form factors, according to the manufacturer.

The 2x2mm devices are suitable for assembly on flat-cable printed-circuit boards that simplify design in today's space-constrained consumer devices. The patented package technology allows equipment manufacturers to place the 'sound hole' either on the top or the bottom of the package to ensure the slimmest possible design and shortest acoustic path from the environment to the microphone. While the microphones with the sound hole on the top (top-port) suit the size and sound-inlet position requirements of laptops and tablets, the bottom-port microphones are mostly used in mobile phones.

Stringent compression and drop tests have shown that microphones in plastic packages also outperform traditional metallic-lid devices in durability. When subjected to a force of 40N – equivalent to placing a 4kg weight on the tiny chip – microphones in metallic packages collapsed, whereas ST devices in plastic packages remained intact, says the company. Similar results were obtained when devices from both categories were exposed to 40 drops from a height of 1.5m with a static force of 15N applied on the package.

The superior robustness holds for both flat-cable printed-circuit boards (PCB) and traditional rigid PCB designs. The plastic-package microphones integrate an internal shielding cage for uncompromised electromagnetic immunity and are compatible with standard surface-mount assembly machinery and conventional pick-and-place equipment.

Visit STMicroelectronics at http://www.st.com.

This article originally appeared on EE Times Europe.


TAG:MEMS microphones acoustic plastic package

2x2mm MEMS microphones delivered in tough plastic packages

2x2mm MEMS microphones delivered in tough plastic packages

STMicroelectronics' novel microphone-assembly process ensures superior electrical and acoustic performance, unbeatable mechanical robustness, and slimmer form factors, according to the manufacturer.

The 2x2mm devices are suitable for assembly on flat-cable printed-circuit boards that simplify design in today's space-constrained consumer devices. The patented package technology allows equipment manufacturers to place the 'sound hole' either on the top or the bottom of the package to ensure the slimmest possible design and shortest acoustic path from the environment to the microphone. While the microphones with the sound hole on the top (top-port) suit the size and sound-inlet position requirements of laptops and tablets, the bottom-port microphones are mostly used in mobile phones.

Stringent compression and drop tests have shown that microphones in plastic packages also outperform traditional metallic-lid devices in durability. When subjected to a force of 40N – equivalent to placing a 4kg weight on the tiny chip – microphones in metallic packages collapsed, whereas ST devices in plastic packages remained intact, says the company. Similar results were obtained when devices from both categories were exposed to 40 drops from a height of 1.5m with a static force of 15N applied on the package.

The superior robustness holds for both flat-cable printed-circuit boards (PCB) and traditional rigid PCB designs. The plastic-package microphones integrate an internal shielding cage for uncompromised electromagnetic immunity and are compatible with standard surface-mount assembly machinery and conventional pick-and-place equipment.

Visit STMicroelectronics at http://www.st.com.

This article originally appeared on EE Times Europe.


TAG:MEMS microphones acoustic plastic package

A Womens Handbag of Decision is Personal Womens Leather Handbag On Sale

As being a woman, I can’t image myself with out my purse and I realize that lots of other ladies agree. A lady definitely demands her handbag by her side to hold her issues around and in addition to make a fashion assertion. In conjunction with her clothing, sneakers, and jewellery, the proper handbag completes the final glimpse. Selecting the most appropriate purse is like an artwork form that lots of ladies discover although developing up. Loads of our vogue is influenced by our popular celebs and from advertisements we see on tv. We then commence to establish our personal unique design and style, which we modified once in a while, and have this into our adulthood as we develop into extra stylish.

Women’s handbag options are constantly modifying as they age. They decide on designs that are not only age-appropriate and also in line with their social standing and life style. Occupation gals are additional most likely to go for just a smooth structured shoulder bag to get a business variety look. Many women carry styles of well-known designer handbags which include designer inspired replica handbags should the spending budget is not there for the big designer identify makes. Other girl may perhaps pick a vintage on the lookout purse. No matter if your on the night out for the town of just hanging out with pals, there are several purse designs to select from that suit the situation.

Females know what looks very good on them and what does not. Youthful gals may favor shoulder or hobo style handbags which might be a lot more in line with their age and life style while mature ladies may well go for purses which can be extra formal and common in models. To observe purses created of denim, quilted on some non leather materials are widespread with youthful women. There are various styles of purses with innumerable alternatives to pick from for the marketplace for virtually every certain situation.

A woman’s purse of selection is usually individual. Selecting the right purse just isn’t minimal to what appears superior but how a lady feels about this with regard to if she is relaxed with it or not. Thus, it really is a issue of deciding upon the purse which is suitable for her. If you’re inside the position of deciding upon a purse as a gift for a lady you’ll want to test to remember the styles of handbags you have found her carrying in the in advance of.

Test to keep in mind if at any point if she had talked about anything about a specific purse fashion that she’s serious about. Should you be a male choosing a purse to get a women, and you are in doubt for any rationale, it is actually most likely best to question a different gals for her viewpoint previous to you make your option. When you ‘re inside of a retail outlet, the simplest matter to do is always to request the profits clerk as there is certainly a significant likelihood which they have faced this case lots of instances around and formulated the knowledge for recommending the suitable purse. Consider that a handbag is not only an accessory. It is just a really import piece in completing a women’s type.


A Womens Handbag of Decision is Personal Womens Leather Handbag On Sale

TAG:decision handbag personal womens

Wolfson wins audio slot in Samsung smartphone

Wolfson wins audio slot in Samsung smartphone


LONDON – Wolfson Microelectronics plc (Edinburgh, Scotland), a mixed-signal fabless chip company, has announced that its WM1811 audio hub IC is being used within the Galaxy S III smartphone from Samsung.

The Galaxy range of Android smartphones was introduced in 2010 and the first unit, the Galaxy S sold 24 million units. The Galaxy S II has sold 28 million units and the Galaxy Note tablet has sold 7 million units, according to Information Week. The Galaxy smartphones have been pitched as rivals to the iPhone from Apple and the S III is expected to be a big seller.

Wolfson made a net loss of $6.2 million on sales revenue of $30.3 million in the first quarter of 2012 so there is hope that the Samsung design win can help drive Wolfson towards profitability.

However, the Wolfson has supplied the WM8994 audio hub to Samsung for several of its smartphones previously.

"Our continued success with Samsung, particularly within its range of smartphones and tablets, is testament to the unrivalled quality of our HD Audio Hubs, and the unique features in our products that allow manufacturers to create differentiated audio experiences," said Mike Hickey, Wolfson's CEO, in a statement.


Related links and articles:

www.wolfsonmicro.com

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TAG:Wolfson Microelectronics Samsung Galaxy smartphone tablet computer semiconductor audio

PV gross margins fell 75% in Q1

PV gross margins fell 75% in Q1

PARIS – Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.

The industry gross profit fell below $500 million in the first quarter of 2012, the lowest level since 2008 and more than 75 percent lower on an annual basis, stated the latest report from IMS Research. This results from continued price pressure and highly competitive market conditions.

“Profit margins have been the victim as suppliers have been forced to engage in a fierce price war and have reduced prices faster than they have been able to reduce their costs,” declared Sam Wilkinson, IMS Research senior market analyst. “High inventory levels, weak demand and reduced government support for PV have all contributed to a rapid downward spiral for PV module prices.”

IMS Research said it expects that gross margins will stabilize at nine percent on average in the second half of 2012, with additional price declines offset by improvements in non-silicon processing costs and continued declines in blended silicon purchase prices, which are forecast to reach $25/kg in the third quarter of 2012.




TAG:Photovoltaics Market IMS Research Solar Silicon

PV gross margins fell 75% in Q1

PV gross margins fell 75% in Q1

PARIS – Average gross profits of crystalline photovoltaic (PV) industry module manufacturers fell to 9 cents per watt in the first quarter of 2012 and are expected to decline further to 7 cents per watt by the end of 2012, according to IMS Research market report.

The industry gross profit fell below $500 million in the first quarter of 2012, the lowest level since 2008 and more than 75 percent lower on an annual basis, stated the latest report from IMS Research. This results from continued price pressure and highly competitive market conditions.

“Profit margins have been the victim as suppliers have been forced to engage in a fierce price war and have reduced prices faster than they have been able to reduce their costs,” declared Sam Wilkinson, IMS Research senior market analyst. “High inventory levels, weak demand and reduced government support for PV have all contributed to a rapid downward spiral for PV module prices.”

IMS Research said it expects that gross margins will stabilize at nine percent on average in the second half of 2012, with additional price declines offset by improvements in non-silicon processing costs and continued declines in blended silicon purchase prices, which are forecast to reach $25/kg in the third quarter of 2012.




TAG:Photovoltaics Market IMS Research Solar Silicon

Wolfson wins audio slot in Samsung smartphone

Wolfson wins audio slot in Samsung smartphone


LONDON – Wolfson Microelectronics plc (Edinburgh, Scotland), a mixed-signal fabless chip company, has announced that its WM1811 audio hub IC is being used within the Galaxy S III smartphone from Samsung.

The Galaxy range of Android smartphones was introduced in 2010 and the first unit, the Galaxy S sold 24 million units. The Galaxy S II has sold 28 million units and the Galaxy Note tablet has sold 7 million units, according to Information Week. The Galaxy smartphones have been pitched as rivals to the iPhone from Apple and the S III is expected to be a big seller.

Wolfson made a net loss of $6.2 million on sales revenue of $30.3 million in the first quarter of 2012 so there is hope that the Samsung design win can help drive Wolfson towards profitability.

However, the Wolfson has supplied the WM8994 audio hub to Samsung for several of its smartphones previously.

"Our continued success with Samsung, particularly within its range of smartphones and tablets, is testament to the unrivalled quality of our HD Audio Hubs, and the unique features in our products that allow manufacturers to create differentiated audio experiences," said Mike Hickey, Wolfson's CEO, in a statement.


Related links and articles:

www.wolfsonmicro.com

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TAG:Wolfson Microelectronics Samsung Galaxy smartphone tablet computer semiconductor audio