2012-02-15
TEL joins CEA-Leti programs on DSA, maskless litho
LONDON – Tokyo Electron Ltd., a Japanese supplier of IC and display production equipment, has joined two collaborative lithography research projects being organized by the CEA-Leti (Grenoble, France) research institute.
One is the Ideal project on directed self-assembly (DSA). DSA uses inherent processes within materials to produce ordered structures. Some of these processes, such as the formation of stripes within polymeric materials, can be fined tuned by altering the chemistry to achieve nanometric features that can be used to augment optical and extreme ultra-violet lithography.
The objective of the Ideal project is to develop processes and materials for DSA lithography on 300-mm wafers for manufacturing nodes beyond 20-nm. It has already started to attract strong industrial interest, said CEA-Leti.
It is notable that the IMEC (Leuven, Belgium) research institute has just announced it has installed a fab-compatible DSA lithography flow in its pilot fab, realized in collaboration with the University of Wisconsin, AZ Electronic Materials and Tokyo Electron Ltd.
The second program is the Imagine project in support of the evolution and the launch maskless multibeam direct-write e-beam lithography technology developed by Mapper Lithograhy BV (Delft, The Netherlands).
CEA-Leti has announced the extension of the R&D program for an additional three years. This will include the installation of the first pre-production tools at CEA-Leti facilities in Grenoble.
"The TEL interest in joining both development programs on ML2 [maskless lithography] and DSA is a strong message to the industry of the coming maturity of these lithography solutions for the next advanced nodes," said Serge Tedesco, CEA-Leti program manager.
Related links and articles:
www.leti.fr
www.mapperlithography.com
News articles:
IMEC announces directed self-assembly process line
Maskless e-beam litho good for 14-nm, says CEA-Leti
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TEL joins CEA-Leti programs on DSA, maskless litho
TAG:Tokyo Electron directed self assembly TEL CEA Leti lithography DSA maskless multibeam e beam direct write semicondutor
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